Planar Bridging-Droplet Thermal Diode
dc.contributor.author | Boreyko, Jonathan B. | en |
dc.contributor.author | Edalatpour, Mojtaba | en |
dc.contributor.author | Murphy, Kevin | en |
dc.contributor.author | Mukherjee, Ranit | en |
dc.contributor.inventor | Boreyko, Jonathan B. | en |
dc.contributor.inventor | Edalatpour, Mojtaba | en |
dc.contributor.inventor | Murphy, Kevin | en |
dc.contributor.inventor | Mukherjee, Ranit | en |
dc.date.accessioned | 2022-02-22T03:58:45Z | en |
dc.date.available | 2022-02-22T03:58:45Z | en |
dc.date.filed | 2021-06-25 | en |
dc.date.issued | 2021-12-30 | en |
dc.date.updated | 2022-02-22T03:58:43Z | en |
dc.description.abstract | This disclosure provides a thermal diode including a first plate having a first surface defining a wick structure. The thermal diode can include a second plate having a smooth surface facing the wick structure, the smooth surface and the wick structure defining a chamber for accommodating a phase-change liquid. The thermal diode also can include a separator positioned between the first plate and the second plate to separate the wick structure from the smooth surface by a gap that is less than a capillary length of the phase-change liquid. | en |
dc.identifier.applicationnumber | US 2021-039106 | en |
dc.identifier.orcid | Boreyko, Jonathan [0000-0003-0344-5868] | en |
dc.identifier.patentnumber | WO/2021/263114 | en |
dc.identifier.uri | http://hdl.handle.net/10919/108807 | en |
dc.publisher | Innovators Legal | en |
dc.rights | In Copyright | en |
dc.rights.uri | http://rightsstatements.org/vocab/InC/1.0/ | en |
dc.title | Planar Bridging-Droplet Thermal Diode | en |
dc.type | Patent | en |
pubs.organisational-group | /Virginia Tech | en |
pubs.organisational-group | /Virginia Tech/Engineering | en |
pubs.organisational-group | /Virginia Tech/Engineering/Mechanical Engineering | en |
pubs.organisational-group | /Virginia Tech/All T&R Faculty | en |
pubs.organisational-group | /Virginia Tech/Engineering/COE T&R Faculty | en |
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