Dual-Use Strain Sensors for Acoustic Emission and Quasi-Static Bending Measurements
| dc.contributor.author | Stiefvater, Jason | en |
| dc.contributor.author | Kang, Yuhong | en |
| dc.contributor.author | de Clerck, Albrey | en |
| dc.contributor.author | Mao, Shuo | en |
| dc.contributor.author | Jones, Noah | en |
| dc.contributor.author | Deem, Josh | en |
| dc.contributor.author | Wicks, Alfred | en |
| dc.contributor.author | Ruan, Hang | en |
| dc.contributor.author | Ng, Wing | en |
| dc.date.accessioned | 2024-03-12T17:50:23Z | en |
| dc.date.available | 2024-03-12T17:50:23Z | en |
| dc.date.issued | 2024-03-02 | en |
| dc.date.updated | 2024-03-12T16:38:01Z | en |
| dc.description.abstract | In this paper, a MEMS piezoresistive ultrathin silicon membrane-based strain sensor is presented. The sensor’s ability to capture an acoustic emission signal is demonstrated using a Hsu–Nielsen source, and shows comparable frequency content to a commercial piezoceramic ultrasonic transducer. To the authors’ knowledge, this makes the developed sensor the first known piezoresistive strain sensor which is capable of recording low-energy acoustic emissions. The improvements to the nondestructive evaluation and structural health monitoring arise from the sensor’s low minimum detectable strain and wide-frequency bandwidth, which are generated from the improved fabrication process that permits crystalline semiconductor membranes and advanced polymers to be co-processed, thus enabling a dual-use application of both acoustic emission and static strain sensing. The sensor’s ability to document quasi-static bending is also demonstrated and compared with an ultrasonic transducer, which provides no significant response. This dual-use application is proposed to effectively combine the uses of both strain and ultrasonic transducer sensor types within one sensor, making it a novel and useful method for nondestructive evaluations. The potential benefits include an enhanced sensitivity, a reduced sensor size, a lower cost, and a reduced instrumentation complexity. | en |
| dc.description.version | Published version | en |
| dc.format.mimetype | application/pdf | en |
| dc.identifier.citation | Stiefvater, J.; Kang, Y.; de Clerck, A.; Mao, S.; Jones, N.; Deem, J.; Wicks, A.; Ruan, H.; Ng, W. Dual-Use Strain Sensors for Acoustic Emission and Quasi-Static Bending Measurements. Sensors 2024, 24, 1637. | en |
| dc.identifier.doi | https://doi.org/10.3390/s24051637 | en |
| dc.identifier.uri | https://hdl.handle.net/10919/118314 | en |
| dc.language.iso | en | en |
| dc.publisher | MDPI | en |
| dc.rights | Creative Commons Attribution 4.0 International | en |
| dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | en |
| dc.subject | acoustic emission | en |
| dc.subject | MEMS | en |
| dc.subject | strain sensor | en |
| dc.subject | source location | en |
| dc.subject | quasi-static plate bending | en |
| dc.title | Dual-Use Strain Sensors for Acoustic Emission and Quasi-Static Bending Measurements | en |
| dc.title.serial | Sensors | en |
| dc.type | Article - Refereed | en |
| dc.type.dcmitype | Text | en |