Evaluation of Phenol Formaldehyde Resin Cure Rate
TR Number
Date
2005-04-29
Authors
Journal Title
Journal ISSN
Volume Title
Publisher
Virginia Tech
Abstract
Description
Keywords
parallel-plate rheometry, thermoset resin cure, dielectric analysis
We collect and process your personal information for the following purposes: Authentication, Preferences, Acknowledgement and Statistics.
To learn more, please read our privacy policy.