Dual-Use Strain Sensors for Simultaneous Strain Measurement  and Acoustic Source Location

The use of metal strain gauges and ultrasonic transducers have long been studied in the field of Nondestructive Evaluation (NDE) as a part of structural health monitoring (SHM). Strain gauges use electrical resistance to monitor strains during the loading of a component. Ultrasonic transducers are piezo devices that use a crystal-like sensing element with very low excitation energy that can monitor small strains such as acoustic emissions (AEs). These types of devices have been used to locate the sources of AEs from artificial sources, such as Hsu-Nielsen pencil lead break (PLB) tests, or natural sources such as quasi-static fracture or crack propagation. This type of evaluation has significant advantages over other types of damage inspections such as liquid die penetrant, Blue Light, Eddy Current, or X-ray inspections where visual inspections, large defects, and high levels of user experience are required. The ultrathin silicon membrane (USM) sensor developed by NanoSonic Inc. is a piezoresistive sensor, incorporating the best aspects of a conventional strain gauge and ultrasonic transducer. The sensor can measure both the strain of a component, as well as any acoustic emission that is emitted on the component. To the author's knowledge this is the only sensor capable of simultaneous measurement of these two data types. This paper presents the sensor's ability to be used for quasi-static fracture monitoring. The sensor is first compared to commercial ultrasonic transducers in an unloaded pencil lead break (PLB) test for determining the ability in measuring lamb waves for source location estimation. The NanoSonic USM sensor is further compared to commercial strain gauges and ultrasonic transducers during a PLB test under a tensile load where it is demonstrated the USM sensor yields similar measurements to both commercial sensors. The final test was a quasi-static fracture test, where the NanoSonic USM sensor was able to detect substantially lower energy AEs than the previous test and record the strain history during fracture. This duality of the USM sensor demonstrates an inherent usefulness to NDE and SHM fields. The sensor offers sensing capabilities comparable to commercially available sensors in a smaller package, with less power consumption, at a lower cost.