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    Planar Bridging-Droplet Thermal Diode

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    Date
    2021-12-30
    Inventor
    Boreyko, Jonathan B.
    Edalatpour, Mojtaba
    Murphy, Kevin
    Mukherjee, Ranit
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    Abstract
    This disclosure provides a thermal diode including a first plate having a first surface defining a wick structure. The thermal diode can include a second plate having a smooth surface facing the wick structure, the smooth surface and the wick structure defining a chamber for accommodating a phase-change liquid. The thermal diode also can include a separator positioned between the first plate and the second plate to separate the wick structure from the smooth surface by a gap that is less than a capillary length of the phase-change liquid.
    URI
    http://hdl.handle.net/10919/108807
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    • Scholarly Works, Mechanical Engineering [429]
    • Virginia Tech Patents [689]

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