Liquid Metal-Vitrimer Conductive Composite for Recyclable and Resilient Electronics
dc.contributor.author | Ho, Dong Hae | en |
dc.contributor.author | Jiang, Meng | en |
dc.contributor.author | Tutika, Ravi | en |
dc.contributor.author | Worch, Joshua C. | en |
dc.contributor.author | Bartlett, Michael D. | en |
dc.date.accessioned | 2025-06-13T12:30:07Z | en |
dc.date.available | 2025-06-13T12:30:07Z | en |
dc.date.issued | 2025-06-01 | en |
dc.description.abstract | Electronic devices are ubiquitous in modern society, yet their poor recycling rates contribute to substantial economic losses and worsening environmental impacts from electronic waste (E-waste) disposal. Here, recyclable and healable electronics are reported through a vitrimer-liquid metal (LM) microdroplet composite. These electrically conductive, yet plastic-like composites display mechanical qualities of rigid thermosets and recyclability through a dynamic covalent polymer network. The composite exhibits a high glass transition temperature, good solvent resistance, high electrical conductivity, and recyclability. The vitrimer synthesis proceeds without the need for a catalyst or a high curing temperature, which enables facile fabrication of the composite materials. The as-synthesized vitrimer exhibits a fast relaxation time with reconfigurability and shape memory. The electrically conductive composite exhibits high electrical conductivity with LM volume loading as low as 5 vol.%. This enables the fabrication of fully vitrimer-based circuit boards consisting of sensors and indicator LEDs integrated with LM-vitrimer conductive wiring. Electrical self-healing and thermally triggered material healing are further demonstrated with the composites. The vitrimer and LM-composite provide a pathway toward fully recyclable, mechanically robust, and reconfigurable electronics, thus advancing the field of electronic materials. | en |
dc.description.sponsorship | All authors acknowledged support from the Institute for Critical Technology and Applied Science (ICTAS) at Virginia Tech. D.H.H., R.T., and M.D.B. also acknowledged support from the National Science Foundation CAREER award (2238754). J.C.W. and M.J. also acknowledged start-up funding from Virginia Tech. | en |
dc.description.version | Published version | en |
dc.format.mimetype | application/pdf | en |
dc.identifier.doi | https://doi.org/10.1002/adma.202501341 | en |
dc.identifier.uri | https://hdl.handle.net/10919/135502 | en |
dc.language.iso | en | en |
dc.publisher | Wiley-VCH | en |
dc.rights | Creative Commons Attribution 4.0 International | en |
dc.rights.uri | http://creativecommons.org/licenses/by/4.0/ | en |
dc.title | Liquid Metal-Vitrimer Conductive Composite for Recyclable and Resilient Electronics | en |
dc.title.serial | Advanced Materials | en |
dc.type | Article - Refereed | en |
dc.type.dcmitype | Text | en |