Evaluation and Analysis on the Effect of Power Module Architecture on Common Mode Electromagnetic Interference

dc.contributor.authorMoaz, Tahaen
dc.contributor.committeechairDiMarino, Christinaen
dc.contributor.committeememberZhang, Richarden
dc.contributor.committeememberBoroyevich, Dushanen
dc.contributor.departmentElectrical and Computer Engineeringen
dc.date.accessioned2023-10-23T18:21:27Zen
dc.date.available2023-10-23T18:21:27Zen
dc.date.issued2023-05-02en
dc.description.abstractWide bandgap (WBG) semiconductor devices are becoming increasing popular in power electronics applications. However, WBG semiconductor devices generate a substantial amount of conducted electromagnetic interference (EMI) compared to silicon (Si) devices due to their ability to operate at higher switching frequencies, higher operating voltages and faster slew rates. This thesis explores and analyzes EMI mitigation techniques that can be applied to a power module architecture at the packaging level. In this thesis, the EMI footprint of four different module architectures is measured experimentally. A time domain LTspice simulation model of the experimental test setup is then built. The common mode (CM) EMI emissions that escape the baseplate of the module into the converter is then examined through the simulation. The simulation is used to explore the CM noise footprint of eight additional module architectures that were found in literature. The EMI trends and the underlying mitigation principle for the twelve modules is explained by highlighting key differences in the architectures using common mode equivalent modelling and substitution and superposition theorem. The work aims to help future module designers by not only comparing the EMI performance of the majority of module architectures available in literature but by also providing an analysis methodology that can be used to understand the EMI behavior of any new module architecture that has not been discussed. Although silicon carbide (SiC) modules are used for this study, the results are applicable for any WBG device.en
dc.description.abstractgeneralAs society moves towards the electric grid of the future, there have been increasing calls for high efficiency, high power density, and low electromagnetic interference (EMI) power electronic converters. EMI is a big problem when using wide-bandgap (WBG) devices as these devices can switch very quickly and handle higher voltages when compared to silicon devices. In this study, ways to reduce EMI in a WBG power module through twelve different types of packaging are explored. Four WBG power modules are designed and fabricated in the lab, whereas a simulation model was created to study the EMI behavior of the remaining eight power module. The EMI behavior of these modules is explained using common mode (CM) equivalent modeling and substitution and superposition theorem. This study is important because WBG devices are becoming more and more popular in power electronic applications. The author hopes the findings and analysis presented in this paper can help future module designers reduce the EMI footprint of modules they design.en
dc.description.degreeM.S.en
dc.format.mediumETDen
dc.format.mimetypeapplication/pdfen
dc.identifier.urihttp://hdl.handle.net/10919/116530en
dc.language.isoenen
dc.publisherVirginia Techen
dc.rightsAttribution 4.0 Internationalen
dc.rights.urihttp://creativecommons.org/licenses/by/4.0/en
dc.subjectConducted electromagnetic interferenceen
dc.subjectElectromagnetic interferenceen
dc.subjectSemiconductor packagingen
dc.subjectWide band gap power semiconductor devicesen
dc.subjectSilicon carbide (SiC)en
dc.subjectPower Electronicsen
dc.subjectEMI analysis at device packaging levelen
dc.subjectCommon Mode Equivalent EMI modellingen
dc.subjectModule Architecture Evaluationen
dc.titleEvaluation and Analysis on the Effect of Power Module Architecture on Common Mode Electromagnetic Interferenceen
dc.typeThesisen
thesis.degree.disciplineEE Electronics Components, Circuits, and Systemsen
thesis.degree.grantorVirginia Polytechnic Institute and State Universityen
thesis.degree.levelmastersen
thesis.degree.nameM.S.en

Files

Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
Moaz_T_T_2023.pdf
Size:
10.65 MB
Format:
Adobe Portable Document Format
License bundle
Now showing 1 - 1 of 1
Name:
license.txt
Size:
1.5 KB
Format:
Item-specific license agreed upon to submission
Description:

Collections